99.9% Pure Copper C1100 ETP copper strip copper sheet
Pure copper C11000ETP
| GB/T |
DIN |
EN |
ASTM |
| TU2 |
E Cu58 |
Cu ETP |
C11000 |
Material introduction:C11000(Cu ETP)
Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity
butcompared with other high conductivity copper due to the high residua oxygen content of the alloy
it is not suitable for processing(annealing welding etc.)and use in high temperature (temperature greater
than 370 ° C ) reducing gas.Because it is prone to hydrogen embrittlement when the material is heated
to 600°C or higher the oxygen inside material will form water vapor with the hydrogen in the air causing
the internal structureof the material to be brittle and cremated so hydrogen embrittlement occurs.
Material Features:
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
Physical properties
| Density(g/cm3) |
8.9 |
| Electrical conductivity{IACS%(20℃)} |
100 |
| Modulus of elasticity(KN/mm2) |
127 |
| Thermal conductivity{W/(m*K)} |
394 |
| Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃) |
17.7 |
Mechanical Properties
| Temper |
Tensile Strength |
Elongation A50 |
Hardness |
| (Rm,Mpa) |
% |
HV |
| 0 |
195min |
35min |
60max |
| 1/4H |
215-255 |
25min |
55-100 |
| 1/2H |
255-315 |
15min |
75-120 |
| H |
290min |
5min |
80 |
Chemical composition