GB/T |
DIN |
EN |
ASTM |
JIS |
/ |
CuNi9Sn6 |
CuNi9Sn6 |
C72700 |
/ |
Cu |
Rem |
Ni |
9.0 |
Sn |
6.0 |
Density(g/cm3) |
8.89 |
Electrical Conductivity IACS%(20℃)} |
11min |
Modulus Of Elasticity(KN/mm2) |
130 |
Thermal Conductivity {W/(m*K)} |
54 |
Coefficient Of thermal expansion ( 10-6/℃ 20/℃ ~100/℃) |
17.3 |
Temper |
Tensile Strength |
Yield strength |
Elongation A50 |
Hardness |
(Rm,MPa) |
(Rp0.2,MPa) |
(%) |
(HV) |
|
TB00 |
420-520 |
≥180 |
≥25 |
95-130 |
TH00 |
≥750 |
≥700 |
≥10 |
260-330 |
TD02 |
600-700 |
≥550 |
≥7 |
180-230 |
TH02 |
≥880 |
≥800 |
≥5 |
280-340 |
TD04 |
675-775 |
≥600 |
≥1 |
210-240 |
TH04 |
≥930 |
≥900 |
≥1 |
300-350 |
TM00 |
600-840 |
≥500 |
≥15 |
200-300 |
TM02 |
800-900 |
≥750 |
≥10 |
260-300 |
TM04 | 850-950 | ≥800 | ≥5 | 280-330 |
TM06 | ≥900 | ≥850 | ≥5 | ≥310 |